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1/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. cmos ldo regulators fo r p o t a bl e equi pment s system regulator with high ef ficiency dc/dc converters BH6172GU descriptions BH6172GU incorporates 1 dcdc+ 5 linear ldo regulators. it is integrated in a sm all 2.6mm2.6mm size package, with 16 steps adjustable vos for every channel, low voltage output (0.8 v~) to support almost any kind of mobile application now available. f eat ures 1) 1ch 500ma, high efficiency step-down converter. (16 steps adjustable vo by i 2 c) 2) 5-channel cmos-type ldos. (16 steps adjustable vo by i 2 c, 150ma 3, 300ma 2) 3) power on/off control enabled by i2c interface or external pin 4) i 2 c compatible interface. (device address is 1001111) 5) wafer level csp package(2.6mm 2.6mm) for space-constrained applications 6) discharge resistance selectable for power-down sequence ramp speed control 7) over-current protection in all ldo regulators 8) over-current protection in step-down converter 9) over-voltage protection in step-down converter 10) thermal shutdown protection ap pli c ati ons mobile phones, portable game systems, portable mp3 play ers, portable dvd players, portable tv, portable gps, pda, portable electronic dictionaries, etc. abs o lute maxim u m ratings (ta=25 ) parameter symbol ratings unit maximum supply voltage (vbat) vbatmax 6.0 v maximum supply voltage (pbat) vpbatmax 6.0 v maximum supply voltage (vusb) vusbmax 6.0 v maximum supply voltage (dvdd) dvddmax 4.5 v maximum input voltage 1 (lx, fb, out1, out2, out3, out4, out5, en_ld1, en_ld2, en_ld3, en_ld4) vinmax1 vbat + 0.3 v maximum input voltage 2 (nrst, clk, data) vinmax2 dvdd + 0.3 v power dissipation pd 900* 1 mw operating temperatur e range topr -35 +85 storage temperature range tstg -55 +125 * this is an allowable loss of the rohm evaluation glass epoxy board(60mm 60mm 16mm). to use at temperature higher than 25 , derate 9.0mw per 1 . *1 must not exceed pd or aso. no.11020eat08 downloaded from: http:///
technical note 2/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU re comm en de d oper ati ng co nd iti ons (ta=25 ) parameter symbol ratings unit vbat voltage vbat 2.20 5.50* 2 v pbat voltage vpbat 2.20 5.50* 2 v vusb voltage vusb 2.20 5.50* 2 * 3 v dvdd voltage vdvdd 1.70 4.20* 4 v *2 whenever the vbat or pbat or vusb vo ltage is under the ldo, swreg output voltage, or else under certain levels, the ldo and swreg output is not guaranteed to meet its published specifications. *3 vusb power supply can be externally connect ed to the vbat, pbat power supply when necessary. *4 the dvdd voltage must be under the ba ttery voltage vbat, pbat at any times. electrical characteristics (unless otherwise specified, ta=25 , vbat=pbat =3.6v, vusb=5.0v) parameter symbol limits unit condition min. typ. max. circuit current vbat circuit current 1 (off) iqvb1 - 0.4 1 a ldo1 5=off swreg1=off nrst=l dvdd=0v vusb circuit current 1 (off) iqusb1 - 0 1 a vbat circuit current 2 (off) iqvb2 - 0.4 1 a ldo1 5=off swreg1=off nrst=l dvdd=0v vusb=vbat external connection vbat circuit current 3 (standby) iqvb3 - 0.7 1.4 a ldo1 5=off swreg1=off nrst=h dvdd=2.6v vusb circuit current 2 (standby) iqusb2 - 0 1 a vbat circuit current 4 (standby) iqvb4 - 0.7 1.4 a ldo1 5=off swreg1=off nrst=h dvdd=2.6v vusb=vbat external connection vbat circuit current 5 (active) iqvb5 - 170 300 a ldo1 5=on(no load, initial voltage) swreg1=on(no load, initial voltage) nrst=h dvdd=2.6v vusb circuit current 3 (active) iqusb3 - 35 70 a vbat circuit current 6 (active) iqvb6 - 200 350 a ldo1 5=on(no load, initial voltage) swreg1=on(no load, initial voltage) nrst=h dvdd=2.6v vusb=vbat external connection this product is not especially designed to be protected from radioactivity. downloaded from: http:///
technical note 3/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU electrical characteristics (unless otherwise specified, ta=25 , vbat=pbat =3.6v, vusb=5.0v, dvdd=2.6v) parameter symbol limits unit condition min. typ. max. logic pin character nrst (cmos input) input h level vih1 dvdd 0.7 - dvdd +0.3 v pin voltage: dvdd input l level vil1 -0.3 - dvdd 0.3 v pin voltage: 0 v input leak current iic1 0 0.3 1 a en_ld1, en_ld2, en_ld3, en_ld4 (nmos input) input h level vih2 1.44 - - v input l level vil2 - - 0.4 v input leak current iic2 -1 0 1 a digital characteristics (digital pins: clk and data ) input "h" level vih3 dvdd 0.8 - dvdd +0.3 v input "l" level vil3 -0.3 - dvdd 0.2 v input leak current iic3 -1 0 1 a pin voltage: dvdd data output "l" level voltage vol - - 0.4 v iol=6ma swreg output voltage vosw 0.94 1.00 1.06 v initial value io=100ma output current io sw - - 500 ma vo=1.00v efficiency sw - 90 - % io=100ma, vo=2.40v, vbat=3.2v oscillating frequency f osc - 1.7 - mhz vo=1.00v output inductance l swreg 1.5 2.2 - h ta= -30 75 short circuit current i shtsw - 500 - ma ta= -30 75 output capacitance c swreg 3.3 4.7 - f ta = - 3 0 75 with swreg's dc bias downloaded from: http:///
technical note 4/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU electrical characteristics (unless otherwise specified, ta=25 , vbat=pbat =3.6v, vusb=5.0v) parameter symbol limits unit condition min. typ. max. ldo1 output voltage vo m1 0.970 1.000 1.030 v initial value io=1ma@vbat=4.5v io=150ma@vbat=3.4v output current vom1c - - 150 ma vo=1.0v dropout voltage vom1dp - 0.1 - v io=50ma input voltage stability S vim1 - 2 - mv vbat=3.4 4.5v, io=50ma vo=1.0v load stability S vlm1 - 20 - mv io=50a 150ma, vbat=3.6v vo=1.0v ripple rejection ratio rrm1 - 60 - db v r =-20dbv, f r =120hz io=50ma, vo=2.6v bw=20hz 20khz short circuit current i shtm3 - 180 - ma vo=0v output capacitor c out1 - 1.0 - f ta = - 3 0 75 with ldo's dc bias ldo2 output voltage vo m2 2.522 2.600 2.678 v initial value io=1ma@vbat=4.5v io=150ma@vbat=3.4v output current vom2c - - 150 ma vo=2.6v dropout voltage vom2dp - 0.1 - v io=50ma input voltage stability S vim2 - 2 - mv vbat=3.4 4.5v, io=50ma vo=2.6v load stability S vlm2 - 20 - mv io=50a 150ma, vbat=3.6v vo=2.6v ripple rejection ratio rrm2 - 60 - db v r =-20dbv, f r =120hz io=50ma, vo=2.6v bw=20hz 20khz short circuit current i shtm3 - 180 - ma vo=0v output capacitor c out2 - 1.0 - f ta = - 3 0 75 with ldo's dc bias ldo3 output voltage vo m3 2.716 2.800 2.884 v initial value io=1ma@vbat=4.5v io=150ma@vbat=3.4v output current vom3c - - 300 ma vo=2.8v dropout voltage vom3dp - 0.1 - v io=50ma input voltage stability S vim3 - 2 - mv vbat=3.4 4.5v, io=50ma vo=2.8v load stability S vlm3 - 20 - mv io=50a 300ma, vbat=3.6v vo=2.8v ripple rejection ratio rrm3 - 60 - db v r =-20dbv, f r =120hz io=50ma, vo=2.6v bw=20hz 20khz short circuit current i shtm3 - 180 - ma vo=0v output capacitor c out3 - 1.0 - f ta = - 3 0 75 with ldo's dc bias downloaded from: http:///
technical note 5/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU el ectrica l cha r acter i stics (unless otherwise specified, ta=25 , vbat=pbat =3.6v, vusb=5.0v) parameter symbol limits unit condition min. typ. max. ldo4 output voltage vo m4 1.746 1.800 1.854 v initial value io=1ma@vbat=4.5v io=300ma@vbat=3.4v output current vom4c - - 300 ma vo=1.8v dropout voltage vom4dp - 0.1 - v io=50ma input voltage stability S vim4 - 2 - mv vbat=3.4 4.5v, io=50ma vo=1.8v load stability S vlm4 - 30 - mv io=50a 300ma, vbat=3.6v vo=1.8v ripple rejection ratio rrm4 - 60 - db v r =-20dbv, f r =120hz io=50ma, vo=2.6v bw=20hz 20khz short circuit current i shtm4 - 340 - ma vo=0v output capacitor c out4 - 1.0 - f ta = - 3 0 75 with ldo's dc bias ldo5 output voltage vo m5 3.201 3.300 3.399 v initial value io=1ma@vusb=5.5v io=150ma@vusb=4.4v output current vom5c - - 150 ma vo=3.3v dropout voltage vom5dp - 0.1 - v io=50ma input voltage stability S vim5 - 2 - mv vusb=4.4 5.5v, io=50ma vo=3.3v load stability S vlm5 - 20 - mv io=50a 150ma, vusb=5.5v vo=3.3v ripple rejection ratio rrm5 - 60 - db v r =-20dbv, f r =120hz io=50ma, vo=2.6v bw=20hz 20khz short circuit current i shtm5 - 180 - ma vo=0v output capacitor c out5 - 1.0 - f ta = - 3 0 75 with ldo's dc bias downloaded from: http:///
technical note 6/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU sw reg & ldos outp ut v o ltage t a bl e parameter usage example power supply initial output voltage load max adjustable range swreg core vbat/pbat 1.00v 500ma 0.80-2.40v ldo1 core vbat 1.00v 150ma 1.00-3.30v ldo2 i/o1 vbat 2.60v 150ma 1.00-3.30v ldo3 memory vbat 2.80v 300ma 1.20-3.30v ldo4 i/o2 vbat 1.80v 300ma 1.20-3.30v ldo5 usb vbat/vusb 3.30v 150ma 1.20-3.30v parameter swreg ldo1 ld o2 ldo3 ldo4 ldo5 programmable output voltages 0.80v 1.00v 1.00v 1.20v 1.20v 1.20v 0.85v 1.10v 1.10v 1.30v 1.30v 1.30v 0.90v 1.20v 1.20v 1.40v 1.40v 1.40v 0.95v 1.30v 1.30v 1.50v 1.50v 1.50v 1.00v 1.40v 1.40v 1.60v 1.60v 1.60v 1.05v 1.50v 1.50v 1.70v 1.70v 1.70v 1.10v 1.60v 1.60v 1.80v 1.80v 1.80v 1.15v 1.70v 1.70v 1.85v 1.85v 1.85v 1.20v 1.80v 1.80v 1.90v 1.90v 1.90v 1.365v 1.85v 1.85v 2.00v 2.00v 2.00v 1.40v 2.60v 2.60v 2.60v 2.60v 2.60v 1.50v 2.70v 2.70v 2.70v 2.70v 2.70v 1.65v 2.80v 2.80v 2.80v 2.80v 2.80v 1.80v 2.85v 2.85v 2.85v 2.85v 2.85v 1.85v 3.00v 3.00v 3.00v 3.00v 3.00v 2.40v 3.30v 3.30v 3.30v 3.30v 3.30v downloaded from: http:///
technical note 7/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU bl ock di agr am, ba ll matri x fig.1 block diagram fig.2 ball matrix pi n descr ipt i o n ball no. pin name function b4 data data input/output for i 2 c c4 clk clk input for i 2 c e1 vbat1 power supply 1 e4 vbat2 power supply 2 a5 pbat power supply for swreg a4 lx inductor connect pin for swreg a3 pgnd ground for swreg b5 fb voltage feed back pin for swreg d4 nrst reset input pin (low active) d5 out1 ldo1 output d1 out2 ldo2 output e5 out3 ldo3 output e3 out4 ldo4 output a1 out5 ldo5 output b1 refc reference voltage output c2 en_ld1 ldo1 enable pin d2 en_ld2 ldo2 enable pin d3 en_ld3 ldo3 enable pin c3 en_ld4 ldo4 enable pin a2 vusb usbvbus power supply *1 c5 dvdd digital power supply c1 gnd analog ground b3 test test pin (always keep open at normal use) e2 test2 test pin (always keep open at normal use) * est, test2 pin is used during our company shipment test. lease keep test pin and test2 pin open at all times. *1 usb power supply can be externally c onnected to the vbat power supply when necessary. swreg 0.8-2.40v vbat1 pbat fb pgnd lx vbat2 gnd ldo1 1.00-3.30v 0.1v step ldo2 1.00-3.30v 0.1v step ldo3 1.20-3.30v 0.1v step ldo4 1.20-3.30v 0.1v step ldo5 1.20-3.30v 0.1v step out1 out2 out3 out4 out5 150ma 300ma 300ma 150ma 150ma 500ma 1f 1f 1f 1f 1f ref refc 0.1f 4.7f 4.7f 2.2h en_ld1 en_ld2 en_ld3 en_ld4 i2c if data clk nrst dvdd init 1.00v init 1.00v init 2.60v init 2.80v init 1.80v init 3.30v vusb (open) test (open) test2 4.7f 1f c out4 vbat2 nrst en_ld3 en_ld4 clk data test lx pgnd vbat1 test2 en_ld2 out2 gnd en_ld1 refc vusb out5 out3 out1 dvdd fb pbat a b d e 12345 downloaded from: http:///
technical note 8/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU i 2 c bus interface the i 2 c compatible synchronous serial interface provides acce ss to programmable functions and register on the device. this protocol uses a two-wire interface for bi-directional communications between the lsis connected to the bus. the two interface lines are the serial data line (data), and t he serial clock line (clk). these lines should be connected to the power supply dvdd by a pull-up resistor, and remain high even when the bus is idle. 1. start and stop conditions when clk is high, pulling data low produces a start condition and pulling data high produces a stop condition. every instruction is started when a start condition occurs and terminated when a stop condition occurs. during read, a stop condition causes the read to terminate and the chip enters t he standby state. during write, a stop condition causes the fetching of write data to terminate, after which writing starts automatically. upon the completion of writing, the chip enters the standby state. two or more start conditions cannot be entered consecutively. t su.sta t hd.sta t su.sto clk data start condition stop condition fig.3 i 2 c start, stop condition 2. data transmission data on the data input can be modified while clk is low. w hen clk is high, modifying the data input means a start or stop condition. t su.dat t hd.dat clk data modify data modify data fig.4 i 2 c data transmission timing all other acknowledge, write, and read timings all conform to the i 2 c standard. 3. device addressing the device address for this device is 1001111. 1001 111 device address code read/write instruction msb lsb r/w fig.5 i 2 c device address downloaded from: http:///
technical note 9/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU i 2 c b u s ac sp ecific ati on characteristics symbol min. max. unit clk clock frequency fclk 0 400 khz clk clock low time tlow 1.3 - s clk clock high time thigh 0.6 - s bus free time tbuf 1.3 - s start condition hold time thd.sta 0.6 - s start condition setup time tsu.sta 0.6 - s data input hold time thd.dat 0 - ns data input setup time tsu.dat 100 - ns stop condition setup time tsu.sto 0.6 - s clk data (input) t f t high t low t r t su.sto t su.dat t hd.dat t su.sta t hd.sta t buf fig.6 bus timing 1 clk data (input) t wr stop condition acknowledge output write data input start condition d o fig.7 bus timing 2 downloaded from: http:///
technical note 10/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU i 2 c re gister i n form atio n regcnt(swregon, ldo*on) control each swreg, ldo. 0 on 1 off swadj(swregadj[3:0]) change swreg output voltage by 16 steps. 0000 0.80v 1111 2.40v ldoadj*(ldo*adj[3:0]) change ldo1 5 output voltage by 16 steps. 0000 1.00v(ldo1, 2) , 1.20v(ldo3, 4, 5) 1111 3.30v pdsel(swpdsel, ldo*pdsel) change the discharge resistance of swreg, ldo. 0 1k 1 10k pdcnt(swpd, ldo*pd) enable/disable the discharge resistance of swreg, ldo. 0 discharge disable 1 discharge enable en_sel(enld*_en) select either an enable pin or i 2 c register for ldo1 4 on/off control. 0 external enable pin selected 1 i 2 c register selected downloaded from: http:///
technical note 11/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU 0 1 2 3 4 5 6 7 8 9 10 00.511.522.533.544.555.56 vb a t [ v ] i _ v bat [ u a] i c c ( of f ) v u sb = 5 .0v 0 1 2 3 4 5 6 7 8 9 10 00.511.522.533.544.555.56 vb a t [ v] i_ v b a t [ u a ] ic c(of f) vb a t =vus b s h o r t 0 1 2 3 4 5 6 7 8 9 10 00.511.522.533.544.555.56 vb a t [ v ] i _ v bat [u a] i c c(stb y) vb a t =vu s b s h o r t 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 3.2 3.7 4.2 4.7 5.2 5.7 vb a t [ v ] i_ v b a t [ m a ] i c c ( ac t i v e ) v b at = v u s b sh or t ref e re nce data(icc) ref e re nce data(sw reg) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 vb at [ v] fb [ v ] s w r e g li ne r egul a t i on v o = 1 . 0 v vbat 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 0 50 100 150 200 250 300 350 400 450 500 io [ma] fb [v] s w r e g l oa d r egu l a t i on v o = 1 . 0 v 0 10 20 30 40 50 60 70 80 90 10 0 0 50 100 150 200 250 300 350 400 450 500 io [ m a ] e f f i ci e n cy[ % ] sw r e g e f f i c i e n c y v s io ( v o = 1 .36 5 v ) v b a t = 3 .6 v downloaded from: http:///
technical note 12/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU reference data(output stability) ref e re nce data(inp u t st abi lit y ) 0 0.5 1 1.5 2 2.5 3 3.5 4 0 50 100 150 200 io [ma] out1 [v] ldo1 load regulation 1.20v 0 0.5 1 1.5 2 2.5 3 3.5 4 0 50 100 150 200 io [ma] out2 [v] ldo2 load regulation 2.60v 0 0.5 1 1.5 2 2.5 3 3.5 4 0 50 100 150 200 250 300 io [ma] out3 [v] ldo3 load regulation 3.0v 0 0.5 1 1.5 2 2.5 3 3.5 4 0 100 200 300 400 io [ma] out4 [v] ldo4 load regulation 1.80v 0 0.5 1 1.5 2 2.5 3 3.5 4 0 50 100 150 200 io [ma] out5 [v] ldo5 load regulation 3.30v 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 00.511.522.533.544.555.56 vbat [v] out1 [v] ldo1 line regulation 1.20v vbat 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 00.511.522.533.544.555.56 vbat [v] out2 [v] vbat ldo2 line regulation 2.60v 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 00.511.522.533.544.555.56 vbat [v] out3 [v] vbat ldo3 line regulation 3.0v 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 00.511.522.533.544.555.56 vbat [v] out4 [v] vbat ldo4 line regulation 1.80v 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 00.511.522.533.544.555.56 vusb [v] out5 [v] ldo5 line regulation 3.30v vusb downloaded from: http:///
technical note 13/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU ref e re nce data(l o a d trans ie nt res p o n se) ref e re nce data(ris e time) ldo1 ldo2 ldo3 ldo4 ldo5 io ldo1 io ldo1 io io ldo2 ldo2 io ldo3 io ldo3 io ldo4 io ldo4 io ldo5 io ldo5 ldo1 ldo2 ldo3 ldo4 en_ld1 ldo1 en_ld2 ldo2 en_ld3 ldo3 en_ld4 ldo4 downloaded from: http:///
technical note 14/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU ref e re nce data(vba t li ne tr ansi ent re sp on se) vba t ldo1 vbat ldo2 vbat ldo3 ldo1 ldo2 ldo3 ldo4 ldo5 vba t ldo4 vusb ldo5 downloaded from: http:///
technical note 15/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU not e s for use (1) absolute maximum ratings if applied voltage (vbat, vadp, vusb), operating temperature range (topr), or other absolute maximum ratings are exceeded, there is a risk of damage. since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded are assumed, consid er applying fuses or other physical safety measures. (2) recommended operating range this is the range within which it is possible to obtain roughly the expected characteristics. for electrical characteristics, i t is those that are guaranteed under the conditions for each parameter. even when these are within the recommended operating range, voltage and temperatur e characteristics are indicated. (3) reverse connection of power supply connector there is a risk of damaging the lsi by reverse connection of the power supply connector. for protection from reverse connection , take measures such as externally placing a diode bet ween the power supply and the power supply pin of the lsi. (4) power supply lines in the design of the board pattern, make power supply and gnd line wiring low impedance. when doing so, although the digital power supply and analog power supply are the same pot ential, separate the digital power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns. similarly take pattern des ign into account for gnd lines as well. furthermore, for all power supply pins of the lsi, in conjunction with inserting capacitors between powe r supply and gnd pins, when using electrolytic capacitors, determine constants upon adequately confirmi ng that capacitance loss occurring at lo w temperatures is not a problem for various characteristics of the capacitors used. (5) gnd voltage make the potential of a gnd pin such that it will be the lowest potential even if o perating below that. in addition, confirm that there are no pins for which the potential becomes less than a gnd by ac tually including transition phenomena. (6) shorts between pins and misinstallation when installing in the set board, pay adequate attention to orient ation and placement discrepancies of the lsi. if it is installed erroneously, there is a risk of lsi damage. t here also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or gnd. (7) operation in strong magnetic fields be careful when using the lsi in a strong magnetic field, since it may malfunction. (8) inspection in set board when inspecting the lsi in the set board, since there is a risk of stress to the lsi when capacitors are connected to low impedance lsi pins, be sure to discharge for each process. mor eover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the power supply. furthermore, as countermeasures against static electricity, use grounding in the assembly process and take appropriate care in transport and storage. (9) input pins parasitic elements inevitably are formed on an lsi structure due to potential relationships. because parasitic elements operate, they give rise to interference with circuit operat ion and may be the cause of malf unctions as well as damage. accordingly, take care not to apply a lower voltage than gnd to an input pin or use the lsi in other ways such that parasitic elements operate. moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the lsi. furthermore, when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within the gu aranteed values of electrical characteristics. (10) ground wiring pattern when there is a small signal gnd and a la rge current gnd, it is recommended that you separate the large current gnd pattern and small signal gnd pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signal gnd voltage to change. take care that the gnd wiring pattern of externally attached components also does not change. (11) externally attached capacitors when using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the rated capacitance due to dc bias and ca pacitance change due to factors such as temperature. (12) thermal shutdown circuit (tsd) when the junction temperature becomes hig her than a certain specific value, the thermal shutdown circuit operates and turns the switch off. the thermal shutdown circuit, which is aimed at isolating the lsi from thermal runaway as much as possible, is not aimed at the pr otection or guarantee of the lsi. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. (14) rush current extra care must be taken on power coupling, power, ground line impedance, and pcb design while excess amount of rush current might instantly flow through the power line when power ing-up a lsi which is equipped with several power supplies, depending on on/off sequence, and ramp delays. downloaded from: http:///
technical note 16/16 www.rohm.com 201 1.03 - rev . a ? 2011 rohm co., ltd. all rights reserved. BH6172GU or der in g p a rt num be r b h 6 1 7 2 g u - e 2 part no. part no. package gu: vcsp85h2 packaging and forming specification e2: embossed tape and reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) vcsp85h2 (BH6172GU) s 0.06 s a b ba 0.05 12345 a b c d e ( 0.15)index post 1.0max 0.25 0.1 0.3 0.05 1pin mark 2.60 0.05 2.60 0.05 0.3 0.05 p=0.5 4 p=0.5 4 24- 0.3 0.05 downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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